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		<title>Emerging Packaging Technologies: A Technical Deep Dive</title>
		<link>https://www.gigalight.com/news-events/insights-7791.html</link>
		
		<dc:creator><![CDATA[易飞扬]]></dc:creator>
		<pubDate>Wed, 15 Nov 2023 08:21:00 +0000</pubDate>
				<category><![CDATA[Industry Insights]]></category>
		<category><![CDATA[data center]]></category>
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					<description><![CDATA[<p>Advanced packaging stands out as a major highlight in the ‘More than Moore’ era. As chip miniaturization becomes increasingly challenging and costly at each process node, engineers are opting to place multiple chips into advanced packaging rather than struggle to further shrink the chips. 3D packaging In 2.5D packaging, bare die stacks or side-by-side placements [&#8230;]</p>
<p>The post <a href="https://www.gigalight.com/news-events/insights-7791.html">Emerging Packaging Technologies: A Technical Deep Dive</a> first appeared on <a href="https://www.gigalight.com">GIGALIGHT</a>.</p>]]></description>
		
		
		
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