200G QSFP56 SR2 help dc with different baud rates interconnect

I. Background Introduction

In the era of the digital flood, data traffic is growing exponentially. The burgeoning development of cloud computing, big data, artificial intelligence, and other cutting-edge technologies has imposed unprecedented demands on the transmission capabilities of optical communication networks. As the core hub of optical communication systems, every innovation in optical module technology is crucial for the efficiency and stability of data transmission. In the pursuit of higher bandwidth beyond single-wave 100G, optical module technology faces new challenges and opportunities. Among numerous technological paths, silicon photonics has emerged as a strong contender, not only deeply penetrating the traditional FRO optical module domain but also making its mark in LPO (Low Power Optical Modules), TRO (Transparent Optical Modules), and CPO (Co-Packaged Optics) frontiers, demonstrating strong competitiveness against traditional EML (Electro-absorption Modulated Laser) solutions, with a trend towards substitution in certain areas.

II. Significant Advantages of Silicon Photonics

(a) Superior Integration Characteristics

Silicon photonics leverages CMOS processes to achieve high integration of various optical devices on a silicon substrate, including lasers, modulators, detectors, and wavelength division multiplexers. This integration advantage is particularly pronounced in high-bandwidth optical module applications, especially in LPO, TRO, and CPO packaging products. For instance, CPO, which directly packages the optical engine with the switch chip, demands extremely high integration and miniaturization of optical modules. Silicon photonics effectively meets this requirement, significantly reducing signal transmission distances and losses, thereby enhancing overall system performance. In addressing bandwidth demands beyond single-wave 100G, silicon photonic modules can accomplish high-speed data transmission tasks with just a few chips paired with a continuous-wave laser. In contrast, traditional EML solutions require more light sources and component combinations, making them ill-suited to the stringent integration requirements of LPO, TRO, and CPO.

(b) Substantial Cost Control Potential

From a chip manufacturing cost perspective, silicon photonic chips benefit from the widespread adoption and mature industrial chain of CMOS processes. In the large-scale production of high-bandwidth optical modules beyond single-wave 100G, silicon photonic chips can fully utilize existing large-scale integrated circuit manufacturing equipment, conferring significant cost advantages. As technology advances and production volumes increase, costs are expected to decline further. In LPO, TRO, and CPO packaging domains, the cost advantages of silicon photonics are equally evident. For example, LPO emphasizes low power consumption and cost, which silicon photonics achieves through high integration, reducing a multitude of components and simplifying assembly and testing processes, thereby effectively lowering module integration costs.

(c) Good Performance and Continuous Optimization

While silicon photonic modulators once lagged behind in bandwidth performance compared to other solutions, they have made remarkable strides in recent years. For instance, AMF employs an innovative waveguide crossover structure to compensate for high-frequency signal phase differences, achieving a flat frequency response. Its modulator insertion loss is as low as 2.1dB, with a bandwidth of 90GHz under equalizer peaking, making it well-suited for high-bandwidth demands beyond single-wave 100G. In TRO coherent optical modules, where precise modulation and high bandwidth are paramount, the performance improvements of silicon photonic modulators have endowed them with strong competitiveness. These achievements lay a solid foundation for realizing even higher-speed silicon photonic modulation, underscoring the vast potential for performance enhancement in silicon photonics. In scenarios like short-distance interconnections within data centers, where high bandwidth is urgently needed, silicon photonics, with its efficient transmission performance and low power consumption, has become the mainstream choice, propelling optical communication technology towards higher bandwidth and lower power consumption.

III. Penetration and Potential Substitution of Silicon Photonics for EML

(a) Gradual Penetration in Data Centers

Data centers demand high-bandwidth optical modules characterized by high speed, low power consumption, and low cost—qualities that align perfectly with the advantages of silicon photonics. Currently, silicon photonic technology has been widely adopted in high-bandwidth applications for short-distance interconnections within data centers and is steadily expanding into medium- to long-distance interconnection domains. In novel packaging products, silicon photonics exhibits formidable penetration capabilities. In LPO applications, silicon photonics rapidly captures market share due to its low power consumption and cost advantages. In the CPO domain, silicon photonics emerges as a pivotal technology for achieving high-density, high-speed data transmission. In contrast, EML solutions face increasing cost disadvantages in high-bandwidth, short-distance data center applications and struggle to meet the technical requirements of LPO, TRO, and CPO. With the continuous advancement of silicon photonic technology, EML’s market share in this domain is at risk of gradual erosion.

(b) Substitution Possibility Through Key Technological Breakthroughs

As research into silicon photonic technology deepens, breakthroughs in high-performance, high-efficiency silicon-based lasers are anticipated. Once this pivotal technological hurdle is overcome, silicon photonic chips will achieve full integration, reducing reliance on external lasers and further enhancing overall performance and integration. In domains like TRO coherent optical modules and CPO, where optical device performance requirements are exceptionally high, silicon photonics will substantially bolster its competitiveness through technological advancements, potentially posing a significant challenge to EML in traditional strongholds like metropolitan and wide-area networks. Although EML still holds certain advantages in long-distance, high-bandwidth transmission, the rapid development of silicon photonics makes its substitution of EML increasingly plausible, especially in emerging application scenarios like LPO, TRO, and CPO.

IV. Challenges and Current Status of EML Solutions

(a) Technological Bottlenecks and Cost Pressures

EML technology boasts a lengthy application history in high-speed optical communications and is relatively mature. However, in the quest for higher bandwidth beyond single-wave 100G, its development encounters bottlenecks. Further breakthroughs in bandwidth performance are increasingly difficult and costly. EML chips, based on InP materials, involve complex growth and manufacturing processes, directly contributing to high chip manufacturing costs. During module integration, the use of multiple discrete optoelectronic devices necessitates more process steps and higher precision requirements, significantly increasing module integration costs. In novel packaging product domains like LPO, TRO, and CPO, EML’s inability to achieve high integration exacerbates its cost disadvantage, placing it at a relative disadvantage when competing against silicon photonics’ low-cost offerings, particularly in the high-bandwidth optical module market where competitiveness wanes.

(b) Market Share Erosion

With the widespread adoption of silicon photonics in high-bandwidth applications within data centers and its successful application in novel packaging products like LPO, TRO, and CPO, EML’s market share has been noticeably eroded. In emerging data center constructions, an increasing number of enterprises opt for silicon photonic high-bandwidth optical modules to meet their high-speed, low-power, and low-cost demands. Although EML retains certain advantages in specific domains like long-distance, high-performance high-bandwidth transmission, these advantages are gradually diminishing as silicon photonic technology progresses in these areas. If EML fails to effectively address cost and technological bottlenecks, its future market share may be further supplanted by silicon photonics, particularly in domains like LPO, TRO, and CPO that represent the future direction of optical module development.

V. Future Outlook for Silicon Photonics

(a) Continuous Technological Innovation

Silicon photonic technology will continue to pursue in-depth innovations in key technological domains. Beyond the development of silicon-based lasers, advancements will also be made in high-performance modulators, photodetectors, and integrated optical circuit design. In novel packaging product application scenarios like LPO, TRO, and CPO, silicon photonic technology will be optimized for diverse needs. For instance, further reducing power consumption and cost in LPO; enhancing coherent optical processing capabilities in TRO; and optimizing optical-electrical co-packaging in CPO. Through the adoption of novel materials, optimization of device structures, and manufacturing processes, silicon photonic chip performance will be further enhanced, with higher integration levels. Future silicon photonic chips are poised to achieve greater functionality integration, better adapting to escalating high-bandwidth demands beyond single-wave 100G, becoming the “all-in-one” chips of the optical communication domain and ushering in more possibilities for optical communication system development.

(b) Comprehensive Expansion of Application Domains

With technological maturity and performance enhancements, the application domains of silicon photonics will extend beyond data centers to encompass metropolitan networks, wide-area networks, 5G communications, satellite communications, and more. In 5G communications, silicon photonic technology can fulfill the demands for high-speed, low-power high-bandwidth optical modules in front-haul, mid-haul, and back-haul segments. In satellite communications, the miniaturization and low-power characteristics of silicon photonic modules will contribute to enhancing satellite communication capabilities and service lifespans. Particularly under the impetus of novel packaging technologies like LPO, TRO, and CPO, silicon photonics will reshape the optical communication market landscape. LPO will propel optical interconnections within data centers towards lower power consumption and higher cost-effectiveness; TRO will facilitate the construction of long-distance, high-speed optical transmission networks; and CPO is expected to become the mainstream technology for ultra-high-speed interconnections within data centers, steering the optical communication industry towards a new era of higher bandwidth and greater efficiency.

VI. Conclusion

In the domain of high-bandwidth optical modules beyond single-wave 100G, silicon photonics, with its superior integration characteristics, substantial cost advantages, and continuously improving performance, is gradually emerging as a pivotal driving force in the development of optical communication technology. It not only deeply entrenches itself in traditional FRO optical module domains but also exhibits robust vitality in frontier packaging products like LPO, TRO, and CPO. The widespread application of silicon photonics in data centers and its penetration and potential substitution of EML herald a new direction in optical communication technology development. Although EML solutions currently retain certain advantages in specific domains, they face increasingly severe challenges amid the rapid development of silicon photonics. Looking ahead, with the continuous innovation of silicon photonic technology and the unceasing expansion of its application domains, silicon photonics is poised to dominate the optical communication market, propelling the optical communication industry into a novel development stage and providing more robust technological support for data transmission in the digital era.

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May 7, 2025, Shenzhen, China. –Recently, GIGALIGHT proudly launched the industry’s cutting-edge 200G QSFP56 SR2 optical module. This module is built on 2×100G PAM4 modulation technology and is a carefully crafted interconnect solution designed to meet the stringent requirements of the next-generation data center for ultra-high speed, low latency, and high compatibility, setting a new benchmark for the industry.

Technological Leadership: Breaking Through the Boundaries of Rate and Energy Efficiency

As data centers accelerate their upgrade to 200G/400G architectures, traditional optical modules are facing severe challenges in terms of transmission rate, power consumption, and compatibility. GIGALIGHT’s 200G QSFP56 SR2 optical module achieves a significant performance leap through three major innovations.

High Rate and Low Power Consumption Combined

This optical module supports a transmission rate of up to 200Gbps (2×100G PAM4), fully meeting the demanding bandwidth requirements of scenarios such as AI/GPU clusters and cloud computing. At the same time, it adopts an advanced energy efficiency optimization design, reducing overall power consumption by 30% compared to traditional solutions, thus providing strong support for the construction of green and low-carbon data centers.

Broad Compatibility for Flexible Interconnection

GIGALIGHT’s 200G QSFP56 SR2 optical module successfully breaks the limitations imposed by differences in switch platforms and is compatible with a variety of mainstream interface standards, including 400G QSFP112 and 400G QSFP56-DD. In addition, it supports multiple AOC interconnection schemes, enabling seamless interconnection between heterogeneous devices and significantly reducing customers’ costs in network upgrade and transformation.

Industry Certification, Highlighting High-Reliability Design

GIGALIGHT’s 200G QSFP56 SR2 optical module has successfully passed multiple industry authoritative certifications and fully complies with QSFP56 MSA and IEEE 802.3 standards. When paired with OM4 multimode fiber, it can achieve a transmission distance of up to 100 meters (SR2), fully meeting the needs of short-distance interconnection within machine rooms.

Innovative Application Scenarios

Unique Application Scenario: Breakout of 400G QSFP112 AOC into 2×200G QSFP56 SR2

This innovative solution effectively breaks the limitations of device ports, enabling flexible interconnection from 400G to 200G and perfectly adapting to high-speed heterogeneous network architectures.

Typical Application Scenario: Breakout of 400G QSFP56-DD SR4 AOC into 2×200G QSFP56 SR2

This solution can meet the needs of efficient interconnection in different switch environments, providing strong support for the flexible deployment of data centers.

Extended Application Scenario: Breakout of 800G OSFP SR8 to 4×200G QSFP56 SR2

By breaking out one 800G OSFP SR8 port into four 200G QSFP56 SR2 ports, this solution greatly enhances network flexibility and assists modern data centers in achieving scalable and high-density deployments.

Comprehensive Coverage of Core Application Scenarios

Data Center Architecture Upgrade

GIGALIGHT’s 200G QSFP56 SR2 optical module can strongly support the transformation of 200G spine-leaf architectures, effectively alleviating port density pressure and optimizing the layout of machine room resources.

Heterogeneous Network Fusion

This optical module can solve the problems of protocol and rate mismatching that arise during the mixed networking of equipment from multiple vendors, reducing the complexity of operation and maintenance and accelerating the iterative upgrade of customers’ networks.

AI Computing Power Interconnection Acceleration

Aimed at scenarios such as AI training and high-performance computing, GIGALIGHT’s 200G QSFP56 SR2 optical module can provide high-speed and low-latency connections, offering solid network support for the development of AI computing power.

About GIGALIGHT

As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

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April 28, 2025, Shenzhen, China. – GIGALIGHT, a global leading provider of optical communication technologies, has unveiled its 100G QSFP28 DWDM1 optical transceiver based on the O-Band (Original Band), further expanding its high-speed optical interconnection product portfolio. This product encompasses 16 wavelength bands with a 200GHz frequency spacing, making it suitable for a variety of short-distance, low-cost DWDM transmission scenarios.

Technical Highlights:

• High-precision O-Band Wavelength Division Multiplexing (WDM)
• 100Gbps Single-Channel Rate: Supports PAM4 modulation and is compatible with IEEE/ITU standards, ensuring seamless integration with existing networks.
• Zero Dispersion Advantage: The O-Band inherently exhibits low dispersion in single-mode fibers, minimizing signal distortion in medium-to-short-distance transmissions without the need for additional compensation.
• Low Power Consumption Design: Consumes less than 3.5W, a 20% reduction compared to similar products, contributing to the construction of green data centers.

Application Scenarios: Flexible Adaptation for High-Density Networks

This product can be widely applied in:

• Metropolitan Access and Aggregation Networks: Provides cost-effective solutions for 5G front-haul and enterprise private lines.
• Data Center Interconnection (DCI): Supports medium-to-short-distance transmissions within 80km, meeting the demands of distributed computing power.
• Open Optical Networks: Decouples from white-box equipment, enhancing network deployment flexibility.

Data Center 10km Interconnection (without SOA Amplifier)

Data Center 30km Interconnection (with SOA Amplifier)

Metropolitan Access and Aggregation Application Scenario (30km with SOA)

Industry Value: Filling the Market Gap for O-Band High-Speed Modules

The Product Director of GIGALIGHT stated, “The O-Band offers unique advantages in metropolitan scenarios due to its dispersion characteristics. The newly launched DWDM1 module fills the market’s urgent need for cost-effective, medium-distance 100G solutions, particularly suitable for operator edge network upgrades.” According to Dell’Oro’s forecast, the global DWDM optical transceiver market is expected to exceed $5 billion by 2025, and GIGALIGHT’s O-Band strategy will strengthen its competitiveness in niche markets.

Future Plans: GIGALIGHT will continue to optimize its O/C/L multi-band product matrix and accelerate the commercial deployment of 400G/800G DWDM technologies.

About GIGALIGHT

As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

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April 23, 2025, Shenzhen, China. – To address the demands for high-speed, high-density, and cost-efficient modern data centers, GIGALIGHT, a global leader in open optical networking, has officially launched its 400G QSFP-DD SR4 to 4×100G single-lane QSFP28/SFP112 SR1 economical short-reach data center interconnection solution. This product leverages innovative architectural design to significantly reduce deployment complexity and total cost of ownership (TCO), offering a flexible and efficient connectivity option for cloud computing, AI compute clusters, and hyperscale data centers.

Table 1: Core Product Technical Specifications

High-Density Elastic Architecture

• Modular Design: The 400G QSFP-DD SR4 acts as an upstream port, branching into four independent 100G QSFP28/SFP112 SR1 downstream links via multimode/single-mode fiber, supporting 1:4 non-blocking transmission. This design increases single-port bandwidth utilization by 300% and conserves switch port resources.
• Cross-Platform Compatibility: Deeply aligned with mainstream data center Top of Rack (TOR) architectures, it seamlessly integrates with NVIDIA, Broadcom, and other leading switch chip platforms.

Single-Lane Technology Revolution

• Proprietary Innovation: Based on GIGALIGHT’s single-lane 100G PAM4 modulation technology, this solution overcomes traditional parallel multi-fiber schemes, enabling stable 100-meter transmission over OM4 multimode fiber with 20% lower power consumption than comparable alternatives, meeting stringent energy efficiency requirements for SR short-range scenarios.
• Spectral Efficiency: By carrying 100G data on a single wavelength, it reduces fiber resource usage and enhances transmission density.

Cost-Effective Deployment

• Cost Optimization: Compared to traditional 400G full-optic module networks, this solution reduces high-speed optoelectronic conversion units by 75%, lowering equipment procurement costs. The 100G single-lane transmission also minimizes fiber usage, further reducing construction expenses.
• Rapid Deployment: Supports hot-swappable and plug-and-play functionality, requiring no changes to existing cabling infrastructure and cutting deployment timelines by 60%.

Full-Scenario Compatibility

• Flexible Configuration: Downstream ports can switch between 100G QSFP28 SR1 or 100G SFP112 SR1, ensuring compatibility with existing 100G equipment and emerging single-lane standards, safeguarding customer investments.

Typical Application Scenarios

• AI/GPU Cluster Interconnection: Enhances data transfer efficiency between compute nodes via low-latency, high-bandwidth connections, reducing power consumption.
• Cloud Data Center Spine-Leaf Architecture: Optimizes east-west traffic, alleviates core layer bandwidth strain, and improves network scalability.
• Storage Network Upgrades: Seamlessly integrates with high-speed storage protocols like NVMe over Fabric, accelerating data read/write speeds.

Industry Insights and Future Outlook
With the explosive growth of AI and compute demands, data centers urgently require cost-effective 400G/100G interconnection solutions. GIGALIGHT’s innovative design balances performance and cost, enabling customers to transition smoothly to next-generation network architectures at minimal expense. Looking ahead, GIGALIGHT will continue to advance single-lane technology, driving data center interconnection toward higher density and lower power consumption.

GIGALIGHT’s latest solution not only provides a new choice for data center interconnection but also leads the industry toward more efficient and economical futures through technological innovation.

About GIGALIGHT

As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

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High-speed and stable data transmission capabilities are pivotal for the development of various industries. From data center interconnections to metropolitan area network infrastructure, optical communication technologies face increasingly stringent requirements. DWDM technology, with its high bandwidth and long-distance transmission capabilities, has become a cornerstone of communication networks. Among these, the O-band and C-band each offer unique advantages. GIGALIGHT has introduced three COLOR series 100G DWDM optical transceivers for these two bands, providing users with optimal solutions.

O-band and C-band: Distinctive Tools for Transmission

In DWDM (Dense Wavelength Division Multiplexing) systems, C-band and O-band are two commonly used optical wavelength bands, differing in wavelength range, transmission characteristics, and application scenarios.

O-band: The earliest band used in fiber-optic communications (e.g., early 1310nm systems).

C-band: The core band for modern DWDM, covering 1530–1565nm (expandable to C+L-band, 1565–1625nm).

The zero-dispersion characteristic of O-band is suitable for direct detection (non-coherent), but its high attenuation limits transmission distance.

C-band’s low attenuation and amplifier support make it ideal for long-haul DWDM.

How to Choose Between O-band and C-band?

C-BAND

Requirements: High speed (≥100G), long-distance, high channel density (e.g., operator backbone networks).

Limitations: Requires dispersion compensation and complex DSP (coherent optics).

Long-haul DWDM systems:

Backbone networks, submarine cables (e.g., C-band 96 channels, 100G/400G per channel).

Coherent optical communications (C-band + EDFA for thousands of kilometers of transmission).

Expanded applications:

Combined use of C+L-band (doubling channel capacity, e.g., 192 channels).

O-BAND

Requirements: Low cost, short-range (<40 km), plug-and-play (e.g., intra-data center rack interconnections).

Limitations: No amplifier support, typically ≤100G speed.

Low dispersion: O-band’s low fiber dispersion is suitable for long-distance transmission, reducing signal distortion.

High bandwidth: Through DWDM technology, O-band optical transceivers can transmit multiple wavelengths over a single fiber, significantly increasing transmission bandwidth.

Compatibility: O-band DWDM optical transceivers are generally compatible with existing fiber infrastructure, facilitating upgrades and expansions.

The characteristics of O-band DWDM optical transceivers make them suitable for applications in metropolitan networks and data center interconnections.

GIGALIGHT COLOR Series: Exceptional Choices for O-band and C-band

COLOR X 100G QSFP28 DWDM1 O-BAND

Product speed: 100Gbps, PAM4 modulation mode, 30km transmission distance (with SOA).

Full series of 16 wavelengths, covering O-Band DWDM 1295.56nm~1312.58nm with a 200GHz wavelength interval.

Key Applications:

5G front-haul

Data center interconnection (DCI)

COLOR ZR+ 100G QSFP28 PSM DWDM4

O-band

Product speed: 100Gbps, NRZ modulation mode, 40km transmission distance (with SOA).

Full series of 16 wavelengths, covering ITU-T 694.1 O-Band DWDM 233.6~231.2THz with a 150GHz wavelength interval.

Key Applications:

Point-to-point access networks

C-band

Product speed: 100Gbps, NRZ modulation mode, 120km transmission distance (with EDFA & DCM).

Full series of 48 wavelengths, with 4 channels per device, covering C-Band DWDM 191.3THz to 196.0THz with a 100GHz wavelength interval.

Key Applications:

100G Ethernet metropolitan access via DWDM

Point-to-point access networks

GIGALIGHT’s COLOR series (COLOR X/ZR+) 100G QSFP28 DWDM optical transceivers offer innovative products for both O-band and C-band, providing users with diverse choices. O-band products, with their low loss and no need for dispersion compensation, have broad application prospects in metropolitan access scenarios. C-band products, known for their maturity, stability, and long-distance transmission capabilities, are the preferred choice for data center interconnections and cross-metropolitan optical cable transmissions.

As communication technologies continue to evolve and market demands change, GIGALIGHT will continue to develop more cost-effective, non-coherent DWDM transmission solutions in 200G, 400G, and 800G transmission networks using silicon photonics and traditional technologies. We believe that GIGALIGHT’s optical transceiver products will play an even more critical role in future communication networks, providing users with more efficient, reliable, and cost-effective data transmission services, and jointly driving innovation and progress in communication technologies. Choosing GIGALIGHT means choosing endless possibilities for future communications!

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April 16, 2025, Shenzhen, China. – The SVIAZ 2025 International Communications Exhibition will take place from April 22nd to 25th at the Expocentre Fairgrounds in Moscow. GIGALIGHT will participate in the event, presenting innovative optical interconnect products and solutions at Booth 22F40, Pavilion 2 Hall 2. Global customers and partners are invited to visit for in-depth discussions.

At the exhibition, GIGALIGHT will highlight six key technological solutions and demonstrate multiple new product demos, showcasing its expertise in data centers, AI computing networks, 5G communications, DWDM systems, and liquid cooling interconnects.

Featured Solutions and Product Demos:

Incoherent Color ZR+ 100G DWDM Solution

New Product Demo: 100G QSFP28 PSM DWDM4 (C-BAND)

The GIGALIGHT four-carrier Color ZR+ C-BAND 100G QSFP28 PSM DWDM4 optical transceiver features an MPO-12 interface (12-core) paired with an external wavelength division multiplexer/demultiplexer. Powered by DCM dispersion compensation and EDFA amplification, it supports transmission distances of at least 80km. The transmitter employs 4x25G C-band 100GHz DWDM EML lasers, while the receiver uses PIN detectors, offering 48CH wavelengths. With total power consumption below 5W, it delivers 1200G bandwidth over dual-fiber or 400G over single-fiber. This transceiver plugs directly into 100G QSFP28 switch ports, eliminating the need for traditional DWDM electrical layer equipment. GIGALIGHT also provides a one-stop solution with its proprietary intelligent 1U optical layer device, integrating DWDM EDFA, AAWG, and tunable TDM or fixed DCM for rapid deployment.

Incoherent Color X O-BAND DWDM Solution

New Product Demo: 100G QSFP28 DWDM1 (O-BAND)

The GIGALIGHT Color X O-BAND series 100G QSFP28 DWDM1 silicon photonic transceiver utilizes a 200GHz O-BAND DWDM Grid and single-wave 100G PAM4 silicon photonic modulation technology. Equipped with a Duplex LC interface, it offers 16 selectable wavelengths, achieving 1600G total bandwidth over dual-fiber single-mode fiber for DCI interconnects. Paired with an SOA optical amplifier, it supports 30km transmission (10km without SOA) and eliminates the need for dispersion compensation DCM modules. With power consumption below 3.5W, this solution outperforms coherent DWDM in cost, latency, power efficiency, and ease of deployment.

Join Us at SVIAZ 2025!

More product demos await your discovery. Visit GIGALIGHT at Booth 22F40, Pavilion 2 Hall 2, and experience the future of optical networking firsthand.

GIGALIGHT is committed to delivering leading-edge optical communication products and solutions to global customers, driving the convergence of AI computing infrastructure and green energy-efficient technologies. At SVIAZ 2025, we look forward to collaborating with industry partners to explore new opportunities in next-generation networks.

About GIGALIGHT

As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

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In the vast constellation of optical communications, every flicker of light beats as the pulse of the information age. As industry giants wager on the future of 4-channel optical transceivers, GIGALIGHT, a brand that wings on innovation and steers with differentiation, is quietly rewriting the rules of transmission. We understand that if we cannot lead the trend, we will create our own path—the 8-channel optical transceiver is the dazzling fruit of this belief.

8-Channel Optics: GIGALIGHT’s Persistence and Innovation

Since its inception, GIGALIGHT has deeply understood that true innovation stems from profound insight and relentless pursuit of technology. In the field of optical transceivers, we stand out, adhering to the development philosophy of 8-channel optics and crafting a series of high-performance, high-reliability 8-channel optical transceiver product lines. Recently, the 800G QSFP-DD FR8/LR8, designed to fill the gap for medium to long transmission distances, is about to be launched.

GIGALIGHT 800G QSFP-DD FR8/LR8

The newly launched 800G FR8/LR8 adopts the QSFP-DD package and an EML emitter. The 800G QSFP-DD FR8 uses CWDM wavelengths for a transmission distance of 2km, while the 800G QSFP-DD LR8 employs LAN-WDM wavelengths for a transmission distance of 10km.

Compared to 800G FR4/LR4, GIGALIGHT’s 800G series optical transceivers boast superior OSNR performance due to the better signal-to-noise ratio of 100G PAM4 compared to 200G PAM4. This means that in the vast stream of information, our optical signals can travel farther and more stably.

The 800G QSFP-DD FR8/LR8 optical transceivers are suitable for core transmission scenarios in high-performance, high-speed data centers and telecommunication networks:

Data Center Interconnect

Meeting high-speed data transmission needs (supporting multi-wavelength and high channel bandwidth).

• LR8 (LWDM8) supports long-distance transmission of 10km, ideal for connections between large-scale data centers.
• FR8 (CWDM8 with 10nm spacing) supports 2km, suitable for short-distance interconnects between data centers.

Telecom Carrier Networks

Applied in metropolitan area networks and core networks for long-distance optical fiber communication.

Cloud Computing and AI Networks

Satisfying the requirements of cloud services, AI workloads, and other scenarios for large bandwidth, low latency, and high energy efficiency.

High-Frequency Trading and Other Fields

Supporting communication needs for rapid response and low latency.

The Path of Differentiation: GIGALIGHT’s Independent Thinking

GIGALIGHT’s 800G QSFP-DD FR8/LR8 will soon be available, and we are also developing OSFP packaging—stay tuned. We believe that true differentiation does not lie in blindly following trends, but in deeply understanding and anticipating the future. GIGALIGHT, as a pioneer, is leading the new era of 8-channel optical transmission.

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In the rapid development of optical communication technology, data centers have an increasingly urgent demand for high-speed, efficient, and low-energy-consumption optical interconnect solutions. As two highly anticipated technical solutions, Co-Packaged Optics (CPO) and Linearly DrivenPluggable Optics (LPO) exhibit their respective characteristics in the field of optical module applications. However, CPO has obvious advantages over LPO in many aspects.

I. Advantages in Technical Principles and Integration

(A) Highly Integrated Architecture

CPO technology encapsulates the network switch chip and optical module within the same slot, achieving a tight integration between the optical engine and switch chip. This highly integrated architecture significantly shortens the distance between the switch chip and optical engine, fundamentally optimizing the electrical signal transmission path. Taking the connection between typical data center switches and optical modules as an example, in traditional methods, signals would undergo attenuation and delay in longer transmission lines. In contrast, CPO technology drastically reduces signal transmission distance, effectively enhancing electrical signal transmission speed, ensuring signal integrity, and minimizing the likelihood of signal distortion and interference.

Conversely, while LPO employs linear drive technology to eliminate the DSP/CDR chip within the optical module, integrating related functions into the switch chip on the equipment side, the optical module and switch chip remain relatively independent, falling far behind CPO in terms of signal transmission integration and optimization.

(B) Efficient Collaborative Operation

CPO technology enables deep collaborative operation between network switch chips and optical modules. Due to their physical proximity, they can achieve more efficient coordination in data processing and transmission. For instance, when handling large-scale data traffic, the switch chip can promptly and accurately send data to the optical module for optical signal conversion and transmission, while the optical module can swiftly respond by converting received optical signals back into electrical signals for the switch chip. This efficient collaborative operation mode enables CPO to excel in handling large volumes of data and high-rate data transmission tasks, effectively boosting the performance of the entire optical communication system.

In comparison, the collaborative operation between LPO’s optical module and switch chip relies on external interfaces and communication protocols, posing certain limitations in terms of data interaction timeliness and efficiency, making it challenging to meet the stringent demands of future ultra-high-speed, large-scale data transmission.

II. Advantages in Performance

(A) Low Power Consumption

With data center energy consumption becoming increasingly prominent, power consumption has become a critical metric for evaluating optical communication technologies. By shortening signal transmission distance and optimizing the integrated architecture, CPO technology significantly reduces energy loss during signal transmission. Relevant research data indicates that optical communication systems utilizing CPO technology can reduce power consumption by 30% to 50% compared to traditional solutions at the same data transmission rate. For large-scale data centers, this translates to substantial annual savings in electricity costs and contributes to achieving green energy-saving goals.

While LPO reduces some power consumption by eliminating the DSP chip, due to its separated design of the optical module and switch chip, it cannot match CPO in overall power consumption control. Especially in scenarios involving long-distance, high-rate data transmission, LPO’s power consumption disadvantage becomes even more apparent.

(B) High Transmission Rate and Stability

Leveraging its unique architecture and collaborative operation mechanism, CPO technology can support higher transmission rates. Currently, CPO technology has achieved high-speed data transmission of 800G and even 1.6T, demonstrating exceptional transmission stability. In complex network environments, CPO can effectively resist external interference, ensuring the accuracy and continuity of data transmission while reducing the bit error rate. For example, in AI data centers, where massive training data requires high-speed, stable transmission, CPO technology can meet this demand, ensuring efficient AI model training.

LPO’s removal of the DSP chip leads to an increased system bit error rate, posing bottlenecks in transmission distance and rate enhancements. It is more suitable for short-distance scenarios with relatively low rate requirements, falling short of CPO in terms of stability for long-distance, ultra-high-speed data transmission.

III. Advantages in Cost and Maintenance

(A) Long-term Cost Advantages

In the long run, CPO technology offers significant cost advantages. Although initial research and deployment costs for CPO are relatively high, as technology matures and scales up for production, costs will gradually decrease. CPO’s highly integrated nature reduces the number of interfaces and external cable connections between optical modules and switch chips, lowering hardware and cabling costs. Additionally, due to CPO’s low power consumption, long-term electricity cost savings are considerable.

While LPO reduces optical module procurement costs by eliminating DSP chip material costs, in terms of overall equipment costs, the increased performance requirements for switch chips on the equipment side, along with cabling costs, diminish its overall cost advantage in the long term.

(B) Maintenance Convenience and Reliability

In terms of maintenance, CPO technology exhibits high reliability. Its high integration reduces external connection points and potential failure points, lowering the probability of faults. In the event of a failure, CPO technology can quickly locate the issue through advanced monitoring and diagnostic techniques, enhancing maintenance efficiency. For instance, after a large data center adopted CPO technology, equipment failure rates dropped by 30%, and maintenance time was reduced by 50%.

While LPO supports hot-swapping, facilitating maintenance of individual optical modules, its relatively loose system architecture necessitates considerations around compatibility and collaborative operation between optical modules and switch chips during overall system maintenance, increasing maintenance difficulty and complexity.

IV. Current Development Status, Challenges, and Feasibility Comparison for Future Phases

(A) LPO Development Status, Challenges, and Future Feasibility

1.Development Status

At the technical level, LPO has made progress in the field of 800G optical modules. Taking 800gbps rates as an example, its power consumption can be reduced to approximately 8W, marking a substantial 40-45% reduction compared to traditional pluggable optical modules. In market applications, some companies have already begun layouts. For instance, at OFC 2023, Arista was the first to share test results for a 51.2T switch equipped with LPO transceivers, and NVIDIA is poised to be the first to deploy 200G per channel LPO transceivers in its AI clusters by 2025. Many industry-leading clients, such as Meta, are actively considering adopting LPO technology.

2.Challenges

LPO requires specific modules to pair with ASIC switch chips, which diminishes the versatility advantage of pluggable modules. Additionally, link performance and responsibility delineation are challenging, testing is complex, and there currently lacks unified electrical and optical standards, making interoperability between modules from different vendors difficult to guarantee. Furthermore, eliminating the DSP chip reduces power consumption and cost but increases the system bit error rate, posing bottlenecks in transmission distance and rate enhancements.

3.Future Feasibility

Despite challenges, LPO has emerged as a viable alternative to CPO in the 100G per channel interconnect field. By 2029, LPO’s penetration rates in 800G, 1.6T, and 3.2T ports are projected to be 3%, 33%, and 15%, respectively. If NVIDIA adopts LPO for NVLink expansion in its next-generation GPUs, it will significantly boost market demand for 1.6T-DR8 LPO modules, potentially adding over 8 million 1.6T LPO ports by 2027. With continuous technological improvements and the gradual establishment of industry standards, LPO has substantial growth potential in short-distance, cost-sensitive scenarios with moderate rate requirements.

(B) CPO Development Status, Challenges, and Future Feasibility

1. Current Status

Technologically, CPO has achieved high-speed data transmission of 800G and even 1.6T, and it excels in reducing power consumption. Broadcom and Cisco’s CPO products have achieved low power consumption of approximately 7pJ/bit, while CPO solutions from IBM, Coherent, and other companies have further reduced power consumption. In terms of industrial layout, Broadcom announced its next-generation switching ASIC product line equipped with CPO as early as 2021, and its product Bailly has been successfully put into production. Cisco showcased a CPO prototype at OFC2023. Intel placed its Silicon Photonics Group under the Data Center and AI (DCAI) group to fully develop optical engines based on silicon photonics. Additionally, numerous companies such as Ranovus, Marvell, Nubis Communications, Lightmatter, IBM, and others have joined the ranks of CPO technology research and development.

2. Challenges

From a technical perspective, the wiring process of connecting optical fibers from ASICs to the front panel of the PCB is challenging, and the overall testing and optimization after system integration are also complex. In terms of reliability, CPO technology integrates multiple optical modules with chips, leading to an increase in failure rates. For instance, Broadcom’s CPO lab product, which integrates 16 optical modules on a single board, exhibits a failure rate that is more than ten times higher, reducing reliability and stability to one-tenth of their original levels. From a market perspective, CPO research and development require significant financial and human resources, and the production process is complex. Cost reduction requires time and scale effect accumulation, making it difficult to compete with optical modules in the short term. Furthermore, several major CSP cloud vendors in North America have limited interest in CPO, and some overseas companies have even scaled down their research and development teams. Additionally, CPO mass production faces numerous technical challenges, with 3.2T as the generational standard. Mass production is expected no earlier than 2027, with Broadcom currently progressing the fastest, and its first-generation CPO engineering test scheduled for 2025.

3. Late-Stage Feasibility

According to the “2025 China CPO Industry Market Development Trends and Industrial Demand Forecast Report” published by Beijing Zhiyan Kexin Consulting Co., Ltd., the commercialization of CPO technology is expected to start with 800G and 1.6T ports, with commercial use beginning in 2024-2025 and subsequent scaled growth in 2026-2027. By 2033, the global CPO market size is projected to reach $2.6 billion. With the continuous maturation of technology, gradual reduction in costs, and increasing market demand for high-speed, low-power optical communication solutions, CPO is expected to occupy an important position in the future field of optical communications, particularly in data center scenarios with extremely high requirements for transmission rates and power consumption. Market news also indicates that NVIDIA may introduce a new CPO switch at the GTC conference in March 2025. The supply chain reveals that this CPO switch is in the trial production stage, and if progress is smooth, mass production can be achieved in August of this year. These developments demonstrate the potential for the future development of CPO technology.

In summary, CPO technology has significant advantages over LPO in terms of technical principles, performance, cost, and maintenance. Although both CPO and LPO face their own challenges during development (with CPO’s commercialization appearing more difficult relative to LPO), in the long run, with continuous technological breakthroughs and the gradual maturation of the market, CPO, with its unique advantages, is more likely to dominate the future field of optical communications and lead industry trends.

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Currently, the networks we are communicating and constructing on do not possess a low-latency foundation. The belief in networks based on a 100G PAM4 underlying structure has been ingrained for many years. Although history cannot be reversed, it is necessary for us to question the networks, forming a theoretical basis for cognitive retrospection and moving forward anew.

We believe that not all networks are based on common infrastructure purposes. The diversification of network purposes is the ecological foundation for network diversification. Precisely because of this diversification, we cannot blindly accept the theory that networks based on a 100G PAM4 underlying architecture are infallible. Further refinements to this theory are inevitable.

Generally speaking, for applications like high-frequency trading and edge networks that require prompt responses, a more stable network underlayer is necessary. This underlayer does not necessarily rely on 100G PAM4 technology, as the stability of such networks is best achieved on the signal foundation of NRZ and 50G PAM4. If our goal is to achieve higher signal sensitivity and eliminate noise interference, NRZ and 50G PAM4 serve as the optimal bases for network practices. NRZ has an advantage over PAM4 primarily in signal-to-noise ratio (SNR), which is the foundation for eliminating DSP. As we all know, DSP introduces power consumption and significant network latency. Although both 50G PAM4 and 100G PAM4 belong to the PAM4 technology paradigm, their impacts on networks are strikingly different, with vastly different system SNR and power consumption implications. Technologies similar to LPO, which are currently trusted, can indeed form the basis for the next-generation network architecture akin to 50G PAM4. Attempts at this network have actually given us glimpses of the facts.

For high-frequency trading and edge networks, GIGALIGHT offers two evolutionary blueprints for technological practices. One is a network built on 400G QSFP-DD PSM8 optical transceivers, and the other is a network built on 400G QSFP-DD 2×FR4. These two networks can fulfill the purposes of high-frequency trading centers and edge networks, and they possess long-term effectiveness. If people must evolve towards 800G, we can still form a network architecture based on 16×50G PAM4. However, we also believe that both 50G PAM4 and 100G PAM4-based linear LPO and CPO technologies are goals for this network. The main dividing point remains: you must create a sufficiently stable, low-latency, and reliable foundation for this network. There is no need to pursue industry hotspots at the expense of blurring the practical functions of the network.

It is now believed that NV provides the most advanced network hardware for data center computing power, such as pluggable networks based on 200G SERDES/1.6T. However, this network faces challenges such as thermal power consumption and signal integrity. The industry has various technical concepts for improving this network, which are currently being tested and deployed. However, technologies like 3nm DSP, LPO, LRO, or immersion liquid cooling all require a certain amount of time for trial and error. Therefore, generally speaking, CPO may be a better solution. However, the premature definition of CPO makes this vision difficult to achieve in the short term. It is evident that NPO technology is the best practical blueprint for CPO implementation. Personally, I believe that data centers for computing power can continue to innovate along the path of 100G PAM4 without getting caught up in extending or evolving single-channel baud rates to 200G or 400G. Increasing baud rates reduces the system’s SNR and thermoelectric stability. I believe there are limits to deploying higher baud rate networks, and this model can be scientifically refuted, requiring reconsideration. Mainly, people must dispel the misconception that higher baud rates equate to technological advancement.

GIGALIGHT has a rich product line for AI&DC 800G computing power networks. We are currently establishing an innovative and differentiated product line for computing power networks starting from 800G and 1.6T. Products like GIGALIGHT’s 800G CWDM8/LR8 will serve as a supplementary architecture for 800G networks. For 1.6T, GIGALIGHT will begin a new product line layout and will release it by Q4 2025 at the latest.

The stagnation in 100G PAM4 technology research and development has led to difficulties in the innovation and evolution of metropolitan telecommunication networks. It is hard to believe that vast telecommunication networks in different locations can be built on the current underlying foundation of 100G PAM4 Ethernet. Future telecommunication networks must be based on three assumptions: first, building an infrastructure based on space wavelength division optics and a 50G network underlayer; second, developing a new technological platform for the next generation of 100G PAM4 DSP that is suitable for telecommunication networks; and third, establishing the next generation of high-speed networks entirely on the descent of various wavelength coherent technologies. These network architectures are not mutually exclusive, and each network can accommodate these three technologies. The main argument is that at different network nodes, corresponding technologies based on correct understanding are needed. However, this “correct understanding” must be based on the talent, preferences, and understanding of network rights of the network architects.

Based on the above understanding, GIGALIGHT will build the next generation of telecommunication network products within its own technological cognition. Indeed, this is a historical period dominated by computing power networks. However, people should not forget that it is the innovation in telecommunication networks that brings about the foundation for economic and industrial inclusiveness.

As for the most popular data center networks currently, since their concept is entirely focused on the general purpose of “data storage and retrieval,” this purpose is primarily based on simplicity and low cost. Therefore, their evolution is mainly driven by the interest in technological discoveries, the advanced deployment goals of the company’s future business, and assessments of its own economic strength and capabilities. Since the increase in general network baud rates cannot bring any additional benefits, we previously believed that 200G networks represented the optimal balance between cost and technology, and we still believe this today. Investments in 400G, 800G, and 1.6T general networks are mainly aimed at establishing a hierarchical structure within the network. If not driven by the demand for a hierarchical structure, the deployment of higher baud rate networks is solely motivated by the advancement of silicon photonics technology.

In the field of general data center architectures, GIGALIGHT has a comprehensive product line of silicon photonics, as well as a rich product line based on copper cable interconnection, VCSEL-based AOC, and EML technology. Due to the solidification of architectures, these products mainly compete on cost in the industry.

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