Recently, GIGALIGHT has introduced the 100G QSFP28 SR1 and 200G QSFP56 SR2 optical transceivers, specifically designed for short-distance interconnections. Leveraging cutting-edge technology, these transceivers empower customers to effortlessly construct future-ready, efficient network architectures.

Why Opt for 100G QSFP28 SR1 and 200G QSFP56 SR2?

Faced with the widely adopted 100G QSFP28 SR4 and 200G QSFP56 SR4 optical transceivers in the market, customers may wonder: Why choose these new offerings from GIGALIGHT? The answer lies in their tailored design to meet the demands of future network upgrades.

While traditional optical transceivers are mature and cost-effective, they struggle to keep pace with the requirements of high-speed network architectures like 400G/800G amidst the AI-driven network upgrade wave.

Technological Innovation to Meet Future Challenges

With the advent of 100G PAM4 technology, most 400G/800G optical transceivers now employ this technology (4×100G PAM4 and 8×100G PAM4). In this context, continuing to use 4-channel 25G NRZ (100G QSFP28 SR4) or 4×50G PAM4 (200G QSFP56 SR4) technologies would lead to issues such as speed mismatch, port wastage, and soaring costs. GIGALIGHT’s 100G QSFP28 SR1 and 200G QSFP56 SR2 optical transceivers are precisely engineered to address these pain points.

Case Study: Seamless Integration and Effortless Upgrades

Consider the example of connecting an NVIDIA ConnectX-7 (dual-port 200Gb/s) network card with a 400G QSFP112 switch. Direct connection would result in link downtime, with the switch reporting an “Unsupported speed” error. However, introducing the 200G QSFP56 SR2 optical transceiver resolves the issue. By utilizing dual-channel PAM4 modulation technology, this transceiver intelligently splits the 400G QSFP112 port into two independent 200G channels, enabling perfect interconnection with the 200G QSFP56 network card without hardware modifications. Similarly, a 400G QSFP112 switch can automatically recognize a 4×100G link through four 100G QSFP28 SR1 optical transceivers.

When connecting to an 800G switch, direct interconnection can be achieved using 8×100G QSFP28 SR1 or 4×200G QSFP56 SR4 transceivers. Moreover, GIGALIGHT’s 100G QSFP28 SR1 and 200G QSFP56 SR2 transceivers can also directly interconnect with each other, offering great convenience.

100G QSFP28 SR1: Single-Channel Efficiency and Simplified Cabling

Single-Channel Breakthrough: Utilizing PAM4 modulation technology, it achieves high-speed transmission of 100Gbps per channel, significantly reducing the number of optical fibers and simplifying cabling complexity.
Multimode Fiber Support: Based on OM4 fiber, it offers a transmission distance of up to 100 meters, meeting short-distance high-bandwidth demands.
Low Power Consumption Design: With power consumption below 3.5W, it enhances energy efficiency and is suitable for high-density deployment environments.

200G QSFP56 SR2: Dual-Channel Interconnection, Empowering the Future

Flexible Compatibility: Supporting PAM4 modulation technology, it is compatible with various baud rates from 25G to 200G, automatically adapting to mixed 400G/200G environments for seamless interconnection in heterogeneous data centers.
High Performance and Low Power Consumption: Employing advanced DSP chips and VCSEL laser technology, it reduces power consumption by 30% while achieving a single-channel rate of up to 100Gbps, ensuring stability in high-density deployments.
Plug-and-Play: With a standardized QSFP56 package, it supports hot-swapping and DDM real-time monitoring, enabling deployment in minutes and improving operational efficiency by 50%. Cabling costs are reduced by 70% compared to SR4, requiring only dual-core OM4 fiber for 100m transmission.

Broad Application Scenarios to Meet Future Demands

Whether for hyperscale cloud service providers, AI/ML data centers, or financial institutions with extremely high requirements for ultra-low latency, GIGALIGHT’s 100G QSFP28 SR1 and 200G QSFP56 SR2 optical transceivers provide bandwidth elasticity for the next decade.

Conclusion: Unleash Potential Without Obsolescence

By choosing GIGALIGHT’s 100G QSFP28 SR1 and 200G QSFP56 SR2 optical transceivers, you can immediately unlock the full potential of 400G/800G switches without discarding existing 100G/200G equipment, leading you into a new era of future network architectures.

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The explosive growth of artificial intelligence (AI) technology is reshaping the underlying logic of the global digital infrastructure. As the core transmission carrier of data centers and communication networks, the optical transceiver industry is standing in the “eye of the storm” of the AI ​​computing revolution. From the rate iteration of 800G to 1.6T, from the technological leap from traditional pluggable to CPO (co-packaged optics), optical transceivers are not only the “highways” of data transmission, but also the “blood transfusion channels” for AI large model training and reasoning. This article will deeply analyze the technological evolution, market demand and competitive landscape of the optical transceiver industry in the AI ​​era, and look forward to its future development prospects.

AI Computing Power Demand: The Underlying Logic Driving the Iteration of Optical Transceiver Technology

Exponential Demand for Bandwidth in Large-Model Training

The parameter count of individual AI large models has surpassed the trillion level (e.g., GPT-4), and the computing power required for training doubles every 3-4 months, far outpacing Moore’s Law. This directly drives the upgrade of optical interconnection bandwidth within data centers from 100G to 800G/1.6T. Taking NVIDIA’s DGX H100 server cluster as an example, its internal interconnection requires a total bandwidth of at least 4.8 Tbps, with the demand for optical transceivers per single cabinet exceeding 500 units.

Technical Challenges of Low Latency and High Energy Efficiency

AI computing has extremely low tolerance for data transmission latency (requiring less than 100 nanoseconds), while the power consumption of traditional pluggable optical transceivers already accounts for over 30% of the total energy consumption of data centers. CPO technology, by directly packaging the optical engine with the ASIC chip, can reduce power consumption by 40% and latency by 50%, becoming the next technological high ground. According to LightCounting’s forecast, the CPO market size will exceed $5 billion by 2027.

Commercial Breakthroughs in Silicon Photonics Technology

Silicon photonics technology integrates lasers, modulators, and detectors through CMOS processes, significantly reducing the cost and size of optical transceivers. Companies like Intel and Cisco have already launched silicon photonics 400G transceivers, and domestic manufacturers are also accelerating mass production. Yole predicts that the market share of silicon photonics modules will increase from 20% in 2023 to over 60% by 2030.

Market Landscape: Global Supply Chain Restructuring and Domestic Opportunities

“Arms Race” Among North American Cloud Providers

Tech giants such as Meta, Microsoft, and Google plan to increase the penetration rate of optical transceivers in AI data centers to 80% by 2024-2025. Taking Microsoft Azure as an example, its planned deployment of 1.6T optical transceivers will reach 2 million units by 2025, with a market size exceeding $3 billion. North American cloud providers are deeply binding with leading Chinese enterprises through the JDM (Joint Design Manufacturing) model.

Technological Breakthroughs by Chinese Manufacturers

With cost advantages and rapid iteration capabilities, Chinese optical transceiver enterprises have captured over 60% of the global market share. According to Omdia data, Chinese enterprises accounted for over 70% of the 800G market share in 2023.

Supply Chain Resilience Amid Geopolitical Tensions

U.S. semiconductor export controls on China have compelled domestic industry chain vertical integration. From optical chips, packaging materials to testing equipment, the domestic substitution rate has increased to over 50%. Meanwhile, leading companies have evaded tariff risks through overseas bases in Thailand and Malaysia, forming a global production capacity network of “Chinese design + Southeast Asian manufacturing”.

Future Trends: From Technological Evolution to Ecosystem Competition

The Rise of LPO (Linear Direct Drive) Technology

Compared with CPO, the LPO solution eliminates the need for DSP chips, reducing power consumption by 20% and cost by 30%, becoming an alternative for medium- and short-distance transmission.

Optoelectronic Integration and Intelligent Operation and Maintenance

Optical transceivers are evolving towards intelligence, integrating functions such as temperature sensing, power consumption monitoring, and failure prediction. The concept of “autonomous driving networks” proposes dynamically optimizing the working state of optical transceivers through AI algorithms, improving data center energy efficiency by 15%.

Standards Competition and Ecosystem Positioning

Industry alliances have become new battlefields for competition. International organizations such as COBO (Co-Packaged Optics Alliance) lead the formulation of CPO standards, while the China Academy of Information and Communications Technology (CAICT) has taken the lead in establishing the “Optoelectronic Integration Technology Committee” to promote the implementation of domestic standards. In the next five years, whoever holds the discursive power in technological standards will dominate the trillion-dollar AI computing power market.

Challenges and Risks

Uncertainty in Technological Iteration

The parallel development of multiple technological routes such as CPO, LPO, and silicon photonics may lead to risks of redundant investment. For example, if the heat dissipation and yield issues of CPO cannot be overcome, it may trigger industrial turbulence due to a shift in technological routes.

The “Bullwhip Effect” in the Supply Chain

Fluctuations in AI computing power demand may lead to inventory backlogs of optical transceivers. In Q4 2023, order cancellations by North American cloud providers caused some enterprises’ inventory turnover days to soar to over 120 days, exposing the fragility of demand forecasting.

The “Gray Rhino” of Geopolitics

The United States may include optical transceivers in the export control list or even restrict the supply of advanced optical chips to China. If domestic 25G and above DFB lasers cannot make breakthroughs, it will hinder the development of high-end products.

Conclusion

Under the dual revolutions of AI and computing power, the optical transceiver industry has evolved from a “supporting role” in the communications field to a strategic infrastructure for the digital economy. In the short term, the mass production of 800G and the R&D of 1.6T will spawn a new round of growth cycles; in the long term, optoelectronic integration and standards competition will define the industry’s final outcome. For Chinese enterprises, only by achieving a balance between technological innovation, supply chain resilience, and adaptation to international rules can they remain invincible in this global competition and cooperation. The future optical transceiver industry is not just a technological contest but a comprehensive game of ecosystems and strategies.

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Optical transceivers, optical DSPs (oDSPs), and switch ASICs are the core components of data center optical interconnects. The emergence of LPO (Linear-drive Pluggable Optics) and CPO (Co-packaged Optics) is driving the industry toward lower power consumption and higher density.

I. Core Component Functionality Analysis

1. Optical Transceivers: The Bridge for Electro-Optical Conversion

Optical transceivers are critical devices that convert electrical signals to optical signals and vice versa, widely used in data centers and telecom networks. Key functions include:

• Electro-Optical Conversion: Laser diodes modulate electrical signals into optical signals at the transmitter; photodetectors convert optical signals back to electrical signals at the receiver.
• Rate Adaptation: Support multi-rate standards (e.g., QSFP-DD, OSFP) from 100G to 1.6T, covering transmission distances from 50m to 2km.
• Signal Processing: Traditional transceivers rely on DSP chips for equalization, error correction, and dispersion compensation (e.g., DSPs account for ~50% of power consumption in 400G transceivers).

2. Optical DSP (oDSP): The “Brain” of Optical Transceivers

oDSPs are the most valuable electrical chips in transceivers (20%-30% of BOM cost). Key roles include:

• Modulation & Demodulation: In data center scenarios, PAM4 oDSPs use 4-level modulation to boost single-channel rates (e.g., 50G/100G) and compensate for signal distortion. In telecom long-haul scenarios, Coherent oDSPs use QPSK for high-sensitivity transmission.
• Signal Regeneration: Digital signal processing (e.g., FEC) restores degraded signals to ensure long-distance reliability.
• Power Consumption Challenge: In 800G transceivers, oDSPs consume ~6-8W, becoming the primary power source.

3. Switch ASICs: The Central Hub for Data Forwarding

Switch ASICs are the core of switches, responsible for high-speed data frame routing and forwarding. Functions include:

• Port Interconnection: Support multi-port high-speed connections (e.g., 112G SerDes) for low-latency data exchange between servers and storage.
• Protocol Processing: Integrate PAM4 modulation, CDR (Clock and Data Recovery), and flow control to ensure signal integrity.
• Collaborative Optimization: In LPO solutions, ASICs assume partial signal compensation (e.g., linear equalization, clock recovery) previously handled by oDSPs.

II. Technological Breakthroughs and Impacts of LPO & CPO

1. LPO: Cost and Efficiency Gains in Pluggable Architectures

Technical Features:

• DSP-Free Design: Replaces DSPs with high-linearity Driver/TIA chips, eliminating CDR and complex digital processing to reduce power, cost, and latency in 800G LPO modules.
• Compatibility: Retains pluggable formats (QSFP-DD/OSFP) with hot-swappable maintenance, suitable for short-reach (<2km) AI clusters and cost-sensitive scenarios.
• Standardization Progress: Based on OIF CEI-112G-Linear-PAM4, supports partial 800G commercialization, though 224G SerDes requires further validation.

Industry Impact:

• Power Revolution: A rack with 100 400G LPO modules saves >¥2,000 annually in electricity costs (PUE 1.5), with reduced cooling expenses.
• Supply Chain Shift: Reduces reliance on DSP vendors like Marvell/Broadcom, driving localization of Driver/TIA chips.
• Scenario Limitations: Relies on switch ASICs for signal compensation, limiting competitiveness in heterogeneous networks.

2. CPO: Performance Leap in Co-Packaged Architectures

Technical Path:

• Near-Packaging Evolution: From NPO (co-board optical engine) to CPO (co-packaged optical engine), reducing signal transmission distance from 10cm to millimeters, cutting power by 30%-50%.
• Integration Morphologies: Includes Type A (2.5D), Type B (Chiplet), and Type C (3D) packaging, advancing deep integration of silicon photonics with switch ASICs.
• Silicon Photonics Core: CPO relies on silicon photonics for high-density optical device integration, with silicon photonics expected to capture 60% market share by 2030.

Industry Impact:

• Performance Boost: A 1.6T CPO system supports 51.2T total bandwidth with sub-nanosecond latency, meeting AI training clusters’ ultra-high bandwidth demands.
• Ecosystem Challenges: Initially reliant on proprietary designs (e.g., NVIDIA Quantum-X), lacking unified standards, and high O&M costs due to whole-unit replacement for optical engine failures.
• Market Differentiation: CPO targets scale-up networks (e.g., multi-rack AI clusters), while scale-out networks still rely on pluggable modules.

III. Future Trends and Technological Dynamics

1. Multi-Technology Coexistence:

• LPO Dominates Mid-Term: By 2025-2027, LPO will rapidly penetrate AI clusters and mid-sized data centers, with >8M 1.6T LPO ports expected by 2027.
• CPO’s Long-Term Potential: Post-2030, CPO will gradually commercialize in hyperscale data centers, especially for 100T+ scenarios, as silicon photonics matures.
• DSP Persistence: DSP solutions will remain mainstream for long-haul and heterogeneous networks, with power-optimized “Link Optimized-DSP” variants.

2. Synergistic Innovation:

• Silicon Photonics Fusion: Enables LPO (reduces Driver/TIA costs) and CPO (achieves high-density integration), serving as a foundational technology for both.
• Packaging Breakthroughs: 3D packaging and TSV (Through-Silicon Vias) advance CPO to Type C, shrinking size and improving thermal efficiency.
• Standardization: IEEE 802.3 and OIF efforts will accelerate LPO interoperability, while CPO requires open ecosystems to resolve compatibility issues.

3. Supply Chain Restructuring:

• Chip Vendors: Marvell/Broadcom maintain DSP dominance but face LPO competition; NVIDIA/Intel integrate silicon photonics with ASICs via CPO to strengthen system-level competitiveness.
• Transceiver Vendors: Innolight, Eoptolink, etc., actively deploy LPO/CPO but must balance investments with market demand to avoid over-commitment.
• Foundries: TSMC, STMicroelectronics, etc., expand silicon photonics capacity to enable CPO mass production.

IV. Conclusion

The emergence of LPO and CPO marks a pivotal shift from “pluggable-dominated” to “integrated-evolving” optical interconnects. LPO’s low power and ease of deployment make it a mid-term mainstream choice, while CPO’s extreme performance represents the long-term direction. Their competition will drive data center architectures toward greater efficiency and intelligence, offering opportunities and challenges for silicon photonics, advanced packaging, and other underlying technologies. In the future, synergistic development across multiple technological paths will become the norm, with standardization and ecosystem collaboration determining the pace of technology adoption.

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In this era of rapid digital transformation, high-speed, stable, and cost-effective network transmission solutions have become pivotal in driving business growth for enterprises. We understand your needs for enhancing network bandwidth, reducing operational costs, and achieving rapid business deployment. Therefore, we are delighted to introduce two leading 100G DWDM products, along with our cost-effective wavelength division multiplexing (WDM) subsystem solution, aiming to bring an unprecedented upgrade experience to your network architecture.

100G QSFP28 PSM DWDM4 – C-BAND
The Powerhouse for Long-Distance Transmission

Technical Highlights: The 100G QSFP28 PSM DWDM4 – C-BAND employs a four-carrier Color ZR+ C-BAND design. It features 4x25G C-band 100GHz DWDM EML lasers at the transmitter and efficient PIN detectors at the receiver. With support from DCM dispersion compensation and EDFA amplification, it ensures a transmission distance of at least 80km. The MPO-12 interface design simplifies fiber connections, and the total power consumption is below 5W, making it both environmentally friendly and efficient.

Application Scenarios: Ideal for long-distance transmission needs such as 100G Ethernet metropolitan access and point-to-point access networks, providing stable and reliable data transmission channels for operators and enterprises.

One-Stop Solution: Paired with GIGALIGHT’s self-developed intelligent 1U optical layer equipment, including DWDM EDFA, AAWG, and tunable TDM or fixed DCM, it offers customers a complete non-coherent DWDM transmission solution from optical transceivers to optical layer equipment, accelerating business deployment.

100G QSFP28 DWDM1 O-BAND
The Cost-Effective Choice for Short-Distance Transmission

Technical Highlights: The 100G QSFP28 DWDM1 O-BAND silicon photonics module adopts PAM4 modulation mode, supporting a full range of 16 wavelengths covering the O-Band DWDM with a 200GHz wavelength spacing. The O-Band’s natural low-dispersion characteristics reduce signal distortion, eliminating the need for additional dispersion compensation. With a power consumption below 3.5W, it is 20% lower than similar products, contributing to green data center construction.

Application Scenarios: Widely used in medium-to-short-distance transmission scenarios such as metropolitan access and aggregation networks, inter-data center interconnectivity (DCI), and 5G front-haul, providing cost-effective solutions for 5G networks, enterprise private lines, and distributed computing power.

Flexible Adaptability: Decoupled from white-box equipment, it enhances network deployment flexibility and meets customers’ needs for open optical networks.

10km interconnectivity without SOA amplifier

30km interconnectivity with SOA amplifier

Metropolitan access and aggregation applications (30km with SOA)

Cost-Effective WDM Subsystem Solution: The Ultimate Pursuit of Cost Efficiency
GIGALIGHT’s cost-effective WDM subsystem solution focuses on the application of non-coherent DWDM technology, achieving short-distance, high-capacity transmission by simplifying the optical layer design and reducing costs. This solution is particularly suitable for scenarios that are cost-sensitive and have low requirements for transmission distance, such as DCI, 5G, and enterprise private networks.

Core Advantages:

• Cost Efficiency: Hardware costs can be reduced by 30%~50% compared to coherent DWDM solutions, along with reduced deployment and maintenance costs.
• Short-Distance High-Speed Transmission: Leveraging advanced modulation technologies like PAM4, it achieves single-wavelength 100G~400G short-distance transmission, meeting high-speed data transmission needs.
• Simplified Operations and Maintenance: Reduces reliance on complex optical layer management, enhancing system reliability and lowering operational difficulty.
• Green Communication: Low-power design aligns with the trend of low-carbon communication, contributing to the realization of “dual carbon” goals.

GIGALIGHT believes that by introducing our 100G DWDM products and cost-effective WDM subsystem solution, you will significantly enhance network performance, reduce operational costs, and accelerate business innovation. We look forward to collaborating with you to explore new paths for network upgrades and jointly creating a brilliant future in the digital era.

Please feel free to contact us for more product details and customized solutions. We anticipate in-depth exchanges and collaborations with you!

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May 23, 2025, Shenzhen, China. – GIGALIGHT will showcase a variety of innovative incoherent and coherent DWDM solutions at CommunicAsia 2025 in Singapore (May 27 – 29, Booth No. 3E2-5), demonstrating the latest breakthroughs in the field of high-speed, low-power, low-cost, and long-distance optical transmission.

GIGALIGHT Makes Its Appearance at CommunicAsia 2025, Displaying Illustrations of Economical Optical Transmission Solutions for Incoherent and Coherent DWDM

Highlighted Products Preview

Incoherent COLOR ZR+ 100G DWDM Solution: GIGALIGHT’s four-carrier Color ZR+ C-BAND 100G QSFP28 PSM DWDM4 optical transceiver adopts an MPO-12 interface. When paired with an external wavelength division multiplexer and under the amplification of DCM dispersion compensation and EDFA, it can easily achieve over 80km transmission. With a total power consumption of less than 5W, it offers a dual-fiber transmission bandwidth of up to 1200G and a single-fiber bandwidth of 400G. It eliminates the need for traditional DWDM equipment, enabling worry-free rapid deployment.

Incoherent COLOR X O-band DWDM Solution: Based on the O-Band, this 100G QSFP28 DWDM1 optical transceiver covers 16 bands with a 200Ghz frequency interval, specifically designed for short-distance, low-cost DWDM applications. It employs PAM4 modulation technology, delivering a single-channel rate of 100Gbps and being compatible with both IEEE and ITU standards. With a power consumption of only 3.5W, it is an ideal choice for green data centers and medium-to-short-distance DCI.

Coherent 400G DWDM Solution: A newly upgraded 2U DCI system with full network management capabilities, supporting a transmission capacity of 6.4T. Its open network management platform enables comprehensive automated operation and maintenance. With a modular design, it is compatible with both 1U and 2U chassis, featuring excellent heat dissipation and power redundancy. It is suitable for data center interconnectivity and backbone wavelength division transmission, creating a flexible and scalable transmission platform.

As a pioneer in open optical network devices, GIGALIGHT places equal emphasis on technological innovation and green efficiency. It is committed to providing global customers with smarter and more environmentally friendly optical communication products and services.

We sincerely invite global customers to visit Booth 3E2-5 to explore the cutting-edge technologies of DWDM and embark on a new chapter of economical network infrastructure!

About GIGALIGHT

As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

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May 21, 2025, Shenzhen, China. – GIGALIGHT has officially launched its brand-new low-latency optical transceiver series, which brings nanosecond-level value to customers. This series precisely meets the urgent demands for ultra-low latency and high reliability in data centers and high-performance computing scenarios. By optimizing optical performance and signal processing technologies, these products achieve an extremely low bit error rate (BER) without the need for Forward Error Correction (FEC), significantly reducing link transmission delays. As a result, they offer crucial performance advantages in scenarios such as financial trading, AI training, and real-time data analysis.

Core Advantage: Eliminating FEC to Reduce Hundreds of Nanoseconds of Delay

Traditional 25G/100G optical transceivers rely on FEC to ensure link reliability. However, FEC processing introduces additional latency, which can be as high as 250ns. Through innovative design, GIGALIGHT’s low-latency optical transceivers can maintain a BER below 1E-12 (with a typical value of <1E-15) even when FEC is disabled. This directly eliminates the FEC processing step, saving up to 250ns of delay per link.

Product Features and Measured Performance

Below are some representative products from the series along with their test data:

Key Features

• FEC-Disabled Switch Compatibility: The pre-FEC bit error rate (BER on Pre-FEC) meets the requirement of being less than 1E-12, fulfilling the need for systems to disable FEC and reduce latency.
• High-Temperature Stability: All products in the series have passed rigorous 30-minute tests at 70°C, ensuring reliability under extreme operating conditions.

Application Scenarios and Interoperability

• Ultra-Low-Latency Scenarios: Suitable for latency-sensitive fields such as high-frequency trading and distributed databases. Maximum performance can be achieved in FEC-disabled mode.

Supported Platforms

GIGALIGHT’s low-latency optical transceivers have obtained compatibility certifications for mainstream switch platforms, including:

• 25G SFP Ports: Ideal for high-performance Top-of-Rack (ToR) switches and direct server connections.

• 200G QSFP-DD Ports: Support high-density deployments in the core and Spine layers of data centers.

Technological Upgrades, Empowering the Future

The launch of GIGALIGHT’s low-latency optical transceivers not only builds upon its technological expertise in the optical communications field but also provides critical infrastructure for next-generation network architectures through its “zero-FEC latency” design. In the future, GIGALIGHT will continue to optimize product performance, facilitating a smooth evolution from 25G to 200G and assisting customers in building efficient and agile intelligent networks.

About GIGALIGHT

As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

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I. Background Introduction

In the era of the digital flood, data traffic is growing exponentially. The burgeoning development of cloud computing, big data, artificial intelligence, and other cutting-edge technologies has imposed unprecedented demands on the transmission capabilities of optical communication networks. As the core hub of optical communication systems, every innovation in optical module technology is crucial for the efficiency and stability of data transmission. In the pursuit of higher bandwidth beyond single-wave 100G, optical module technology faces new challenges and opportunities. Among numerous technological paths, silicon photonics has emerged as a strong contender, not only deeply penetrating the traditional FRO optical module domain but also making its mark in LPO (Low Power Optical Modules), TRO (Transparent Optical Modules), and CPO (Co-Packaged Optics) frontiers, demonstrating strong competitiveness against traditional EML (Electro-absorption Modulated Laser) solutions, with a trend towards substitution in certain areas.

II. Significant Advantages of Silicon Photonics

(a) Superior Integration Characteristics

Silicon photonics leverages CMOS processes to achieve high integration of various optical devices on a silicon substrate, including lasers, modulators, detectors, and wavelength division multiplexers. This integration advantage is particularly pronounced in high-bandwidth optical module applications, especially in LPO, TRO, and CPO packaging products. For instance, CPO, which directly packages the optical engine with the switch chip, demands extremely high integration and miniaturization of optical modules. Silicon photonics effectively meets this requirement, significantly reducing signal transmission distances and losses, thereby enhancing overall system performance. In addressing bandwidth demands beyond single-wave 100G, silicon photonic modules can accomplish high-speed data transmission tasks with just a few chips paired with a continuous-wave laser. In contrast, traditional EML solutions require more light sources and component combinations, making them ill-suited to the stringent integration requirements of LPO, TRO, and CPO.

(b) Substantial Cost Control Potential

From a chip manufacturing cost perspective, silicon photonic chips benefit from the widespread adoption and mature industrial chain of CMOS processes. In the large-scale production of high-bandwidth optical modules beyond single-wave 100G, silicon photonic chips can fully utilize existing large-scale integrated circuit manufacturing equipment, conferring significant cost advantages. As technology advances and production volumes increase, costs are expected to decline further. In LPO, TRO, and CPO packaging domains, the cost advantages of silicon photonics are equally evident. For example, LPO emphasizes low power consumption and cost, which silicon photonics achieves through high integration, reducing a multitude of components and simplifying assembly and testing processes, thereby effectively lowering module integration costs.

(c) Good Performance and Continuous Optimization

While silicon photonic modulators once lagged behind in bandwidth performance compared to other solutions, they have made remarkable strides in recent years. For instance, AMF employs an innovative waveguide crossover structure to compensate for high-frequency signal phase differences, achieving a flat frequency response. Its modulator insertion loss is as low as 2.1dB, with a bandwidth of 90GHz under equalizer peaking, making it well-suited for high-bandwidth demands beyond single-wave 100G. In TRO coherent optical modules, where precise modulation and high bandwidth are paramount, the performance improvements of silicon photonic modulators have endowed them with strong competitiveness. These achievements lay a solid foundation for realizing even higher-speed silicon photonic modulation, underscoring the vast potential for performance enhancement in silicon photonics. In scenarios like short-distance interconnections within data centers, where high bandwidth is urgently needed, silicon photonics, with its efficient transmission performance and low power consumption, has become the mainstream choice, propelling optical communication technology towards higher bandwidth and lower power consumption.

III. Penetration and Potential Substitution of Silicon Photonics for EML

(a) Gradual Penetration in Data Centers

Data centers demand high-bandwidth optical modules characterized by high speed, low power consumption, and low cost—qualities that align perfectly with the advantages of silicon photonics. Currently, silicon photonic technology has been widely adopted in high-bandwidth applications for short-distance interconnections within data centers and is steadily expanding into medium- to long-distance interconnection domains. In novel packaging products, silicon photonics exhibits formidable penetration capabilities. In LPO applications, silicon photonics rapidly captures market share due to its low power consumption and cost advantages. In the CPO domain, silicon photonics emerges as a pivotal technology for achieving high-density, high-speed data transmission. In contrast, EML solutions face increasing cost disadvantages in high-bandwidth, short-distance data center applications and struggle to meet the technical requirements of LPO, TRO, and CPO. With the continuous advancement of silicon photonic technology, EML’s market share in this domain is at risk of gradual erosion.

(b) Substitution Possibility Through Key Technological Breakthroughs

As research into silicon photonic technology deepens, breakthroughs in high-performance, high-efficiency silicon-based lasers are anticipated. Once this pivotal technological hurdle is overcome, silicon photonic chips will achieve full integration, reducing reliance on external lasers and further enhancing overall performance and integration. In domains like TRO coherent optical modules and CPO, where optical device performance requirements are exceptionally high, silicon photonics will substantially bolster its competitiveness through technological advancements, potentially posing a significant challenge to EML in traditional strongholds like metropolitan and wide-area networks. Although EML still holds certain advantages in long-distance, high-bandwidth transmission, the rapid development of silicon photonics makes its substitution of EML increasingly plausible, especially in emerging application scenarios like LPO, TRO, and CPO.

IV. Challenges and Current Status of EML Solutions

(a) Technological Bottlenecks and Cost Pressures

EML technology boasts a lengthy application history in high-speed optical communications and is relatively mature. However, in the quest for higher bandwidth beyond single-wave 100G, its development encounters bottlenecks. Further breakthroughs in bandwidth performance are increasingly difficult and costly. EML chips, based on InP materials, involve complex growth and manufacturing processes, directly contributing to high chip manufacturing costs. During module integration, the use of multiple discrete optoelectronic devices necessitates more process steps and higher precision requirements, significantly increasing module integration costs. In novel packaging product domains like LPO, TRO, and CPO, EML’s inability to achieve high integration exacerbates its cost disadvantage, placing it at a relative disadvantage when competing against silicon photonics’ low-cost offerings, particularly in the high-bandwidth optical module market where competitiveness wanes.

(b) Market Share Erosion

With the widespread adoption of silicon photonics in high-bandwidth applications within data centers and its successful application in novel packaging products like LPO, TRO, and CPO, EML’s market share has been noticeably eroded. In emerging data center constructions, an increasing number of enterprises opt for silicon photonic high-bandwidth optical modules to meet their high-speed, low-power, and low-cost demands. Although EML retains certain advantages in specific domains like long-distance, high-performance high-bandwidth transmission, these advantages are gradually diminishing as silicon photonic technology progresses in these areas. If EML fails to effectively address cost and technological bottlenecks, its future market share may be further supplanted by silicon photonics, particularly in domains like LPO, TRO, and CPO that represent the future direction of optical module development.

V. Future Outlook for Silicon Photonics

(a) Continuous Technological Innovation

Silicon photonic technology will continue to pursue in-depth innovations in key technological domains. Beyond the development of silicon-based lasers, advancements will also be made in high-performance modulators, photodetectors, and integrated optical circuit design. In novel packaging product application scenarios like LPO, TRO, and CPO, silicon photonic technology will be optimized for diverse needs. For instance, further reducing power consumption and cost in LPO; enhancing coherent optical processing capabilities in TRO; and optimizing optical-electrical co-packaging in CPO. Through the adoption of novel materials, optimization of device structures, and manufacturing processes, silicon photonic chip performance will be further enhanced, with higher integration levels. Future silicon photonic chips are poised to achieve greater functionality integration, better adapting to escalating high-bandwidth demands beyond single-wave 100G, becoming the “all-in-one” chips of the optical communication domain and ushering in more possibilities for optical communication system development.

(b) Comprehensive Expansion of Application Domains

With technological maturity and performance enhancements, the application domains of silicon photonics will extend beyond data centers to encompass metropolitan networks, wide-area networks, 5G communications, satellite communications, and more. In 5G communications, silicon photonic technology can fulfill the demands for high-speed, low-power high-bandwidth optical modules in front-haul, mid-haul, and back-haul segments. In satellite communications, the miniaturization and low-power characteristics of silicon photonic modules will contribute to enhancing satellite communication capabilities and service lifespans. Particularly under the impetus of novel packaging technologies like LPO, TRO, and CPO, silicon photonics will reshape the optical communication market landscape. LPO will propel optical interconnections within data centers towards lower power consumption and higher cost-effectiveness; TRO will facilitate the construction of long-distance, high-speed optical transmission networks; and CPO is expected to become the mainstream technology for ultra-high-speed interconnections within data centers, steering the optical communication industry towards a new era of higher bandwidth and greater efficiency.

VI. Conclusion

In the domain of high-bandwidth optical modules beyond single-wave 100G, silicon photonics, with its superior integration characteristics, substantial cost advantages, and continuously improving performance, is gradually emerging as a pivotal driving force in the development of optical communication technology. It not only deeply entrenches itself in traditional FRO optical module domains but also exhibits robust vitality in frontier packaging products like LPO, TRO, and CPO. The widespread application of silicon photonics in data centers and its penetration and potential substitution of EML herald a new direction in optical communication technology development. Although EML solutions currently retain certain advantages in specific domains, they face increasingly severe challenges amid the rapid development of silicon photonics. Looking ahead, with the continuous innovation of silicon photonic technology and the unceasing expansion of its application domains, silicon photonics is poised to dominate the optical communication market, propelling the optical communication industry into a novel development stage and providing more robust technological support for data transmission in the digital era.

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May 7, 2025, Shenzhen, China. –Recently, GIGALIGHT proudly launched the industry’s cutting-edge 200G QSFP56 SR2 optical module. This module is built on 2×100G PAM4 modulation technology and is a carefully crafted interconnect solution designed to meet the stringent requirements of the next-generation data center for ultra-high speed, low latency, and high compatibility, setting a new benchmark for the industry.

Technological Leadership: Breaking Through the Boundaries of Rate and Energy Efficiency

As data centers accelerate their upgrade to 200G/400G architectures, traditional optical modules are facing severe challenges in terms of transmission rate, power consumption, and compatibility. GIGALIGHT’s 200G QSFP56 SR2 optical module achieves a significant performance leap through three major innovations.

High Rate and Low Power Consumption Combined

This optical module supports a transmission rate of up to 200Gbps (2×100G PAM4), fully meeting the demanding bandwidth requirements of scenarios such as AI/GPU clusters and cloud computing. At the same time, it adopts an advanced energy efficiency optimization design, reducing overall power consumption by 30% compared to traditional solutions, thus providing strong support for the construction of green and low-carbon data centers.

Broad Compatibility for Flexible Interconnection

GIGALIGHT’s 200G QSFP56 SR2 optical module successfully breaks the limitations imposed by differences in switch platforms and is compatible with a variety of mainstream interface standards, including 400G QSFP112 and 400G QSFP56-DD. In addition, it supports multiple AOC interconnection schemes, enabling seamless interconnection between heterogeneous devices and significantly reducing customers’ costs in network upgrade and transformation.

Industry Certification, Highlighting High-Reliability Design

GIGALIGHT’s 200G QSFP56 SR2 optical module has successfully passed multiple industry authoritative certifications and fully complies with QSFP56 MSA and IEEE 802.3 standards. When paired with OM4 multimode fiber, it can achieve a transmission distance of up to 100 meters (SR2), fully meeting the needs of short-distance interconnection within machine rooms.

Innovative Application Scenarios

Unique Application Scenario: Breakout of 400G QSFP112 AOC into 2×200G QSFP56 SR2

This innovative solution effectively breaks the limitations of device ports, enabling flexible interconnection from 400G to 200G and perfectly adapting to high-speed heterogeneous network architectures.

Typical Application Scenario: Breakout of 400G QSFP56-DD SR4 AOC into 2×200G QSFP56 SR2

This solution can meet the needs of efficient interconnection in different switch environments, providing strong support for the flexible deployment of data centers.

Extended Application Scenario: Breakout of 800G OSFP SR8 to 4×200G QSFP56 SR2

By breaking out one 800G OSFP SR8 port into four 200G QSFP56 SR2 ports, this solution greatly enhances network flexibility and assists modern data centers in achieving scalable and high-density deployments.

Comprehensive Coverage of Core Application Scenarios

Data Center Architecture Upgrade

GIGALIGHT’s 200G QSFP56 SR2 optical module can strongly support the transformation of 200G spine-leaf architectures, effectively alleviating port density pressure and optimizing the layout of machine room resources.

Heterogeneous Network Fusion

This optical module can solve the problems of protocol and rate mismatching that arise during the mixed networking of equipment from multiple vendors, reducing the complexity of operation and maintenance and accelerating the iterative upgrade of customers’ networks.

AI Computing Power Interconnection Acceleration

Aimed at scenarios such as AI training and high-performance computing, GIGALIGHT’s 200G QSFP56 SR2 optical module can provide high-speed and low-latency connections, offering solid network support for the development of AI computing power.

About GIGALIGHT

As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

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April 28, 2025, Shenzhen, China. – GIGALIGHT, a global leading provider of optical communication technologies, has unveiled its 100G QSFP28 DWDM1 optical transceiver based on the O-Band (Original Band), further expanding its high-speed optical interconnection product portfolio. This product encompasses 16 wavelength bands with a 200GHz frequency spacing, making it suitable for a variety of short-distance, low-cost DWDM transmission scenarios.

Technical Highlights:

• High-precision O-Band Wavelength Division Multiplexing (WDM)
• 100Gbps Single-Channel Rate: Supports PAM4 modulation and is compatible with IEEE/ITU standards, ensuring seamless integration with existing networks.
• Zero Dispersion Advantage: The O-Band inherently exhibits low dispersion in single-mode fibers, minimizing signal distortion in medium-to-short-distance transmissions without the need for additional compensation.
• Low Power Consumption Design: Consumes less than 3.5W, a 20% reduction compared to similar products, contributing to the construction of green data centers.

Application Scenarios: Flexible Adaptation for High-Density Networks

This product can be widely applied in:

• Metropolitan Access and Aggregation Networks: Provides cost-effective solutions for 5G front-haul and enterprise private lines.
• Data Center Interconnection (DCI): Supports medium-to-short-distance transmissions within 80km, meeting the demands of distributed computing power.
• Open Optical Networks: Decouples from white-box equipment, enhancing network deployment flexibility.

Data Center 10km Interconnection (without SOA Amplifier)

Data Center 30km Interconnection (with SOA Amplifier)

Metropolitan Access and Aggregation Application Scenario (30km with SOA)

Industry Value: Filling the Market Gap for O-Band High-Speed Modules

The Product Director of GIGALIGHT stated, “The O-Band offers unique advantages in metropolitan scenarios due to its dispersion characteristics. The newly launched DWDM1 module fills the market’s urgent need for cost-effective, medium-distance 100G solutions, particularly suitable for operator edge network upgrades.” According to Dell’Oro’s forecast, the global DWDM optical transceiver market is expected to exceed $5 billion by 2025, and GIGALIGHT’s O-Band strategy will strengthen its competitiveness in niche markets.

Future Plans: GIGALIGHT will continue to optimize its O/C/L multi-band product matrix and accelerate the commercial deployment of 400G/800G DWDM technologies.

About GIGALIGHT

As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

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April 23, 2025, Shenzhen, China. – To address the demands for high-speed, high-density, and cost-efficient modern data centers, GIGALIGHT, a global leader in open optical networking, has officially launched its 400G QSFP-DD SR4 to 4×100G single-lane QSFP28/SFP112 SR1 economical short-reach data center interconnection solution. This product leverages innovative architectural design to significantly reduce deployment complexity and total cost of ownership (TCO), offering a flexible and efficient connectivity option for cloud computing, AI compute clusters, and hyperscale data centers.

Table 1: Core Product Technical Specifications

High-Density Elastic Architecture

• Modular Design: The 400G QSFP-DD SR4 acts as an upstream port, branching into four independent 100G QSFP28/SFP112 SR1 downstream links via multimode/single-mode fiber, supporting 1:4 non-blocking transmission. This design increases single-port bandwidth utilization by 300% and conserves switch port resources.
• Cross-Platform Compatibility: Deeply aligned with mainstream data center Top of Rack (TOR) architectures, it seamlessly integrates with NVIDIA, Broadcom, and other leading switch chip platforms.

Single-Lane Technology Revolution

• Proprietary Innovation: Based on GIGALIGHT’s single-lane 100G PAM4 modulation technology, this solution overcomes traditional parallel multi-fiber schemes, enabling stable 100-meter transmission over OM4 multimode fiber with 20% lower power consumption than comparable alternatives, meeting stringent energy efficiency requirements for SR short-range scenarios.
• Spectral Efficiency: By carrying 100G data on a single wavelength, it reduces fiber resource usage and enhances transmission density.

Cost-Effective Deployment

• Cost Optimization: Compared to traditional 400G full-optic module networks, this solution reduces high-speed optoelectronic conversion units by 75%, lowering equipment procurement costs. The 100G single-lane transmission also minimizes fiber usage, further reducing construction expenses.
• Rapid Deployment: Supports hot-swappable and plug-and-play functionality, requiring no changes to existing cabling infrastructure and cutting deployment timelines by 60%.

Full-Scenario Compatibility

• Flexible Configuration: Downstream ports can switch between 100G QSFP28 SR1 or 100G SFP112 SR1, ensuring compatibility with existing 100G equipment and emerging single-lane standards, safeguarding customer investments.

Typical Application Scenarios

• AI/GPU Cluster Interconnection: Enhances data transfer efficiency between compute nodes via low-latency, high-bandwidth connections, reducing power consumption.
• Cloud Data Center Spine-Leaf Architecture: Optimizes east-west traffic, alleviates core layer bandwidth strain, and improves network scalability.
• Storage Network Upgrades: Seamlessly integrates with high-speed storage protocols like NVMe over Fabric, accelerating data read/write speeds.

Industry Insights and Future Outlook
With the explosive growth of AI and compute demands, data centers urgently require cost-effective 400G/100G interconnection solutions. GIGALIGHT’s innovative design balances performance and cost, enabling customers to transition smoothly to next-generation network architectures at minimal expense. Looking ahead, GIGALIGHT will continue to advance single-lane technology, driving data center interconnection toward higher density and lower power consumption.

GIGALIGHT’s latest solution not only provides a new choice for data center interconnection but also leads the industry toward more efficient and economical futures through technological innovation.

About GIGALIGHT

As an open optical networking explorer, Gigalight integrates the design, manufacturing, and sales of both active and passive optical devices and subsystems. The company’s product portfolio includes optical modules, silicon photonics modules, liquid-cooled modules, passive optical components, active optical cables, direct attach copper cables, coherent optical communication modules, and OPEN DCI BOX subsystems. Gigalight focuses on serving applications such as data centers, 5G transport networks, metropolitan WDM transmission, ultra-HD broadcast and video, and more. It stands as an innovative designer of high-speed optical interconnect hardware solutions.

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