Overview

GIGALIGHT, as one of the global leaders in liquid-cooled interconnects, has developed a comprehensive immersed liquid-cooling product line. Its solutions cover the 5G fronthaul product line as well as the latest AI compute applications with 400G and 800G products. These offerings not only address the thermal challenges of high-performance computing but also help drive data centers worldwide toward higher density and lower carbon footprints.

The 400G DR4 and 800G DR8 silicon photonics liquid-cooled modules combine SiPh technology with liquid cooling, reducing module power consumption while further improving energy efficiency.

Technical Highlights

• Silicon Photonics Integration (SiPh): Offers high integration, low power consumption, lower cost, and high-speed transmission. Reduces module power consumption by 30%, supporting 400G/800G and future 1.6T speeds.
• Packaging Design: Unique hermetically sealed housing with pressure resistance >0.2Mpa. The enclosure uses high thermal conductivity materials for 50% improved cooling efficiency in liquid environments. Includes a dedicated seal-check valve to ensure sealing quality.
• Compatibility: Supports multiple form factors, including QSFP112, QSFP-DD, OSFP, and OSFP-RHS, compatible with 100G–800G modules and future 1.6T modules.
• CPO (Co-Packaged Optics) Compatible: Offers ultra-low power options for next-gen 51.2T switches.
• Coolant Types Supported: Fluorinated liquid, mineral oil, silicone oil, etc.

GIGALIGHT Liquid-Cooling SiPh Optical transceviers Portfolio:

No.	Name	Form Factor	Status	Notes
1	800G DR8	OSFP	samples	Inphi DSP++ + silicon photonics
2	400G DR4	OSFP-RHS	samples	Inphi DSP+ + silicon photonics
3	400G DR4	QSFP112	samples	Inphi DSP + silicon photonics

Application Scenarios